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APA4863
Stereo 2.2W Audio Power Amplifier
Features
* * * *
Depop Circuitry Integrated Thermal Shutdown Circuitry Integrated Bridge-Tied Load (BTL) or Single-Ended (SE) Modes Operation Output Power at 1% THD+N, VDD=5V - 2.2W/Ch (Typ.) into a 3 Load - 1.8W/Ch (Typ.) into a 4 Load - 1.2 W/Ch (Typ.) into a 8 Load
General Description
The APA4863 is a stereo bridge-tied audio power amplifier in various power packages, including SOP, TSSOP, and TSSOP-P. When connecting to a 5V voltage supply, the APA4863 is capable of delivering 2.2W/1.8W/1.2W of continuous RMS power per channel into 3/4/8 bridge-tied loads with less than 1% THD+N respectively. When APA4863 operates in the single-ended load, it is capable of delivering 90mW of continuous RMS power per channel into 32 load. The APA4863 simplifies design and frees up board space for other features. T h e A PA4863 also served well in low-voltage applications, which provides 750mW (1% THD+N) per channel into 4 loads with a 3.3V supply voltage. Both of the depop circuitry and the thermal shutdown protection circuitry are integrated in the APA4863, which reduces pops and clicks noise during power up and when using the shutdown mode and protects the chip from being destroyed by over-temperature failure. To simplify the audio system design in notebook computer applications, the APA4863 combines a stereo bridge-tied loads mode for speaker drive and a stereo single-end mode for headphone drive into a single chip, where both modes are easily switched by the HP-IN input control pin signal. For power sensitive applications, the APA4863 also features a shutdown function which keeps the supply current only 0.5 A (typ.).
* * * *
Shutdown Control Mode, ISD= 0.5 A Output Power (SE) at 0.5% THD+N, VDD=5V - 90m/Ch (Typ.) into a 32 Load Various Power Packages Available SOP-16, TSSOP-20, and TSSOP-20P Lead Free and Green Devices Available (RoHS Compliant)
Applications
* * *
Stereo Audio Power Amplifier for Notebook Computer Portable Televisions Portable and Desktop Computers
Ordering and Marking Information
APA4863 Assembly Material Handling Code Temperature Range Package Code APA4863 K/O/R : APA4863 XXXXX Package Code K : SOP-16 O : TSSOP-20 R : TSSOP-20P Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 1 www.anpec.com.tw
APA4863
Pin Configuration
SHUTDOWN GND + OUT A VDD - OUT A - IN A GND + IN A 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B
SHUTDOWN GND + OUT A VDD - OUT A - IN A GND + IN A NC NC 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B NC NC
SOP-16 (Top View)
TSSOP-20 (Top View)
SHUTDOWN GND + OUT A VDD - OUT A - IN A GND + IN A GND GND
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B GND GND
Thermal Pad
TSSOP-20P (Top View)
TSSOP-20P (Bottom View)
Absolute Maximum Ratings
Symbol VDD TA TJ TSTG TS Supply Voltage Operating Ambient Temperature Range Maximum Junction Temperature Storage Temperature Range
(Note 1)
Rating 6 -40 to 85 150 -65 to +150 260 Unit V C C C C
(Over operating free-air temperature range unless otherwise noted.)
Parameter
Maximum Lead Soldering Temperature, 10 Seconds
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Symbol VDD Supply Voltage VDD=5V, 250mW/Ch average power 4- stereo BTL drive, with proper PCB design VDD=5V, 1.8 W/Ch average power 4- stereo BTL drive, with proper PCB design and 300 CFM forced-air cooling VDD=5 V VDD=3.3V Parameter Min. 3 -20 Range Typ. 5 Max. 5.5 85 C -20 85 V Unit
TA
Operating Free-Air Temperature
VICM
Common Mode Input Voltage
1.25 1.25
-
4.5 2.7
V
Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Oct., 2009
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APA4863
Dissipation Rating Table
Packge SOP-16 (Note 2) TSSOP-20
(Note 3)
Air Flow (CFM) 0 0 200 0 200
Thermal Resistance JA(oC/W) 80 73.2 66.6 37.6 32.3
TA25oC 1.6W 1.7W 1.8W 3.3W 3.8W
TA=70oC 1.0W 1.1W 1.2W 2.1W 2.4W
TSSOP-20P (Note 3)
Note 2 : The parameter is measured with the recommended copper heat sink pattern on an 2-layer PCB, 11.7 in2 3.0x2.4 in2 in PCB, 1oz. copper, 3.0x1.5 in2 in coverage at Top-layer and Bottom-layer at 100% coverage (7.2in2). Note 3 :The parameter is measured with the JEDEC standard test boards (multi-layer PCB).
Electrical Characteristics
Electrical Characteristics for Entire IC The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25C
Symbol VDD IDD ISD VIH VIL Parameter Supply Voltage Quiescent Power Supply Current Shutdown Current Headphone High Input Voltage Headphone Low Input Voltage VIN=0V, IO=0A, HP-IN=0V VIN=0V, IO=0A, HP-IN=4V VPIN1= VDD Test Conditions Min. 3 5 4 APA4863 Typ. 9 5 0.5 Max. 5.5 13.5 7.5 0.8 V mA A V V Unit
Electrical Characteristics for BTL Mode Operation The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25C
APA4863 Symbol VOS Parameter Output Offset Voltage VIN=0V THD+N=1%, fin=1kHz RL=3 RL=4 RL=8 THD+N=10%, fin=1kHz RL=3 RL=4 RL=8 AVD=2, fin=1kHz RL=4, PO=1.8W RL=8, PO=1W VDD=5V, VRIPPLE=200mVRMS, RL=8, CB=2.2F fin=1kHz, CB=2.2F, PO=1W, RL=8 VDD=5V, PO=1.1W, RL=8 Test Conditions Min. Typ. 5 2.2 1.8 1.2 2.7 2.3 1.5 0.3 0.15 64 90 95 Max. W mV Unit
PO
Output Power
-
THD+N PSRR XTALK SNR
Total Harmonic Distortion Plus Noise Power Supply Rejection Ratio Channel Separation Signal-to-Noise Ratio
-
-
% dB dB dB
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APA4863
Electrical Characteristics (Cont.)
Electrical Characteristics for SE Mode Operation The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25C
APA4863 Symbol VOS PO THD+N PSRR XTALK SNR Parameter Output Offset Voltage Output Power Total Harmonic Distortion Plus Noise Power Supply Rejection Ratio Channel Separation Signal-to-Noise Ratio VIN=0V THD+N=0.5%, fin=1kHz, RL=32 THD+N=1%, fin=1kHz, RL=8 THD+N=10%, fin=1kHz, RL=8 AV=-1, PO=75mW, fin=1kHz, RL=32 VRIPPLE=200mVRMS, fin=1kHz, CB=2.2F, RL=8, fin=1kHz, CB=2.2F, PO=32mW, RL=32 VDD=5V, PO=340mW, RL=8 Test Conditions Min. Typ. 5 90 320 400 0.02 49 85 95 Max. mV mW % dB dB dB Unit
Truth Table for Logic Inputs
Shutdown Low Low High High HP-IN Low High Low High APA4863 Mode Bridge-Tied Single-Ended APA4863 Shutdown APA4863 Shutdown
Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Oct., 2009
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APA4863
Typical Operating Characteristics
THD+N vs. Output Power
10 VDD=5V, RL=4 BW<80kHz 20Hz
10 VDD=5V, PO=1.8W RL=4, BW<80kHz
THD+N vs. Frequency
THD+N (%)
20kHz 1kHz 0.1
THD+N (%)
1
1
0.1
0.01 10m 100m 1 3
0.01 20 100 1k 10k 20k
Output Power (W)
Frequency (Hz)
Power Dissipation vs. Output Power
1.4 1.2 VDD=5V RL=4 1 0.8 0.6 0.4 0.2 0 RL= 8
THD+N vs. Frequency
10 VDD=5V, PO=1W RL=8, BTL Mode
Power Dissipation (W)
THD+N (%)
1 AVD=10 0.1
AVD=2
0
0.5
1
1.5
2
2.5
0.01
20
Output Power (W)
100 1k Frequency (Hz)
10k 20k
THD+N vs. Frequency
10 VDD=5V, PO=150mW RL=16, SE Mode 1
THD+N vs. Frequency
10 VDD=5V, PO=75mW RL=32, SE Mode 1
THD+N (%)
THD+N (%)
0.1
AV= -5 AV= -1
0.1 AV= -5
AV= -1
0.001
0.001
20 100 1k 10k 20k
20
100
1k
10k 20k
Frequency (Hz) Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 5
Frequency (Hz) www.anpec.com.tw
APA4863
Typical Operating Characteristics (Cont.)
THD+N vs. Output Power
10
THD+N vs. Output Power
10
1
1
fin= 20Hz
THD+N (%)
THD+N (%)
fin= 20kHz 0.1 fin= 20Hz fin= 1kHz
fin= 20kHz 0.1 fin= 1kHz VDD=5V, RL=8 AVD=2, BW< 80kHz BTL Mode 10m 100m 1 2
0.01
0.001 10m
VDD=5V, RL=16 AV=-1, BW< 80kHz SE Mode 70m 200m 500m
Output Power (W)
Output Power (W)
THD+N vs. Output Power
10 VDD=5V, RL=32 AV=-1, BW< 80kHz SE Mode
THD+N vs. Output Power
10 fin= 20kHz 1 fin= 20Hz
1
THD+N (%)
0.1
fin= 20kHz fin= 20Hz fin= 1kHz
THD+N (%)
fin= 1kHz 0.1 VDD=3.3V, RL=4 AVD= 2
0.001 10m
50m
100m
200m
0.01
10m
100m
1
2
Output Power (W)
Output Power (W)
THD+N vs. Frequency
10 VDD=3.3V, PO=700mW RL=4, AVD=2
THD+N vs. Output Power
10
fin= 20kHz
THD+N (%)
THD+N (%)
1
1 fin= 20Hz 0.1 fin= 1kHz VDD=3.3V, RL=8, AVD=2
0.1
0.01
0.01
20 100 1k 10k 20k
10m
100m
1
Frequency (Hz)
Output Power (W)
Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Oct., 2009
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APA4863
Typical Operating Characteristics (Cont.)
THD+N vs. Frequency
10 VDD=3.3V, PO=450mW RL=8, AVD=2
Output Power vs. Load Resistance
0.2 VDD=3.3V, fin=1kHz AVD=2, BW<80kHz 0.15
Output Power (W)
1
THD+N (%)
THD+N = 10% 0.1
0.1
0.05
THD+N = 1%
0.01 20
100
1k
10k 20k
0 0 10 20 30 40
Frequency (Hz)
Load Resistance ()
Power Dissipation vs. Output Power
0.35 VDD=3.3V, SE Mode 0.3
2 1.75
Output Power vs. Supply Voltage
VDD=5V, fin=1kHz RL=8, BW<80kHz BTL Mode THD+N = 10%
Power Dissipation (W)
Output Power (W)
0.25 0.2 0.15 0.1 0.05 0 0
RL=8
1.5 1.25 1 0.75 0.5 0.25
RL=16
THD+N = 1%
0.2 0.4 0.6 Output Power (W)
0.8
0
2
2.5
3 3.5 4 4.5 Supply Voltage (V)
5
5.5
Output Power vs. Supply Voltage
300 250 VDD=5V, fin=1kHz RL=16, BW<80kHz SE Mode
Output Power vs. Supply Voltage
150 130 110 VDD=5V, fin=1kHz RL=32, BW<80kHz SE Mode THD+N = 10%
Output Power
Output Power
200 THD+N = 10% 150 100 THD+N = 1% 50 0 2 2.5 3 3.5 4 4.5 5 5.5
90 70 50
THD+N = 1% 30 10 -10 2 2.5 3 3.5 4 4.5 5 5.5
Supply Voltage (V)
Supply Voltage (V)
Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Oct., 2009
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APA4863
Typical Operating Characteristics (Cont.)
Output Power vs. Load Resistance
1.75 1.5 VDD=5V, f in=1kHz AVD=2, BW<80kHz BTL Mode
Output Power vs. Load Resistance
1 0.8 VDD=5V, fin=1kHz AV=-1, BW<80kHz SE Mode
Output Power (W)
1.25 1 10% THD+N 0.75 0.5 0.25 0 8 18 28 38 48 58 68 1% THD+N
Output Power (W)
0.6 0.4 10% THD+N 0.2 1% THD+N 0 0 10 20 30 40 50 60 70
Load Resistance ()
Load Resistance ()
Power Dissipation vs. Output Power
1.4 1.2 RL=4
0.18 0.16 0.14
Power Dissipation vs. Output Power
Power Dissipation
RL=8 RL=16
Power Dissipation
1 0.8 0.6 0.4 0.2 0 0 0.5 RL=16 RL=32 VDD=5V, fin=1kHz THD+N <1% BW<80kHz BTL Mode 1 1.5 RL=8
0.12 0.1 0.08 0.06 0.04 0.02 0 0
RL=32
VDD=5V, fin=1kHz THD+N <1% BW<80kHz SE Mode 0.3 0.4 0.5
0.1
0.2
Output Power (W)
Output Power (W)
Noise Floor
100
Channel Separation
+0 VDD=5V, RL=8 AVD=2, PO=1W CB=1F BTL Mode
Output Noise Voltage (V)
VO10
Channel Separation (dB)
VO+ + VO-
-20 -40 -60 -80 -100 -120
Channel A to B
VDD=5V, RL=8 AVD=2, CB=1F 1 20 100 1k 10k 20k
Channel B to A 20 100 1k 10k 20k
Frequency (Hz) Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 8
Frequency (Hz) www.anpec.com.tw
APA4863
Typical Operating Characteristics (Cont.)
Channel Separation
+0 -20
+80
Open Loop Frequency Response
VDD=5V SE Mode Gain +50
Channel Separation (dB)
VDD=5V, RL=32 AV=-1, PO=75mW CB=1F SE Mode
+70 +60
-40
Gain (dB)
-60 Channel A to B -80 -100 Channel B to A -120 20 100 1k 10k 20k
+40 +30 +20 +10 +0 100 Phase 1k 10k 100k Frequency (Hz) 1M 10M
Frequency (Hz)
Supply Current vs. Supply Voltage
10 VIN=0V No Load 8 6 BTL Mode (HP-IN=GND)
Supply Current (mA)
4 2 0 SE Mode (HP-IN=VDD)
2
2.5
3
3.5
4
4.5
5
5.5
Supply Voltage(V)
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APA4863
Pin Description
PIN NO. TSSOP-20 TSSOP-20P 1 2,7,19 3 4,17 5 6 8 13 14 15 16 18 20 9,10,11,12 1 2,7,9,10,11, 12,19 3 4,17 5 6 8 13 14 15 16 18 20 SOP-16 1 2,7,15 3 4,13 5 6 8 9 10 11 12 14 16 SHUTDOWN GND +OUT A VDD -OUT A -INA +INA +IN B BYPASS -IN B -OUT B +OUT B HP-IN NC I O I O I I I I O O I Shutdown mode control pin input, places entire IC in shutdown mode when held high, IDD=0.5A. Ground connection of circuitry. A channel + output in BTL mode, high impedance in SE mode. Supply voltage input. A channel - output in BTL mode, + output in SE mode. Input pin of channel A. Non-inverting input of channel A, connected to bypass pin inside the IC. Non-inverting input of channel B, connected to bypass pin inside the IC. Connect to voltage divider for internal mid-supply bias. Input pin of channel B. B channel - output in BTL mode, + output in SE mode. B channel + output in BTL mode, high impedance in SE mode. Headphone control pin input, hold high for single-ended mode operation. No connection. I/O NAME FUNCTION
Block Diagram
VDD CS 0.1F - IN A + IN A* CO
Audio Input
RF
C1 1 F
CB 2.2F Audio Input
VDD / 2 50k - IN B + IN B*
RF 20k
VDD
Shutdown HP-IN 100k GND
To Control Pin on Headphone Jack
Note : * +INA and +INB pins are connected to Bypass pin inside the IC. Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 10 www.anpec.com.tw
+
100k
-
+
C1 1 F
20k
-
R1
20k
+
-
Bypass
50k + OUT A
+
20k 20k 20k - OUT B 20k 20k + OUT B
20k
-
R1
20k
- OUT A
+
RL 8 100F 1k Control Pin Ring
To HP-IN Circuit Sleeve
Tip CO
Headphone Jack
+
100F RL 8 1k
APA4863
Package Information
SOP-16 (300 mil)
D SEE VIEW A
E1
E
h x 45o
e
b
c
0.25 GAUGE PLANE SEATING PLANE L VIEW A
A2 A1 S Y M B O L A A1 A2 b c D E E1 e h L 0 0.25 0.40 0o 0.10 2.05 0.31 0.20 10.10 10.10 7.40 1.27 BSC MILLIMETERS MIN.
A SOP-16 (300mil) INCHES MIN.
MAX. 2.65 0.30
MAX. 0.104
0.004 0.081
0.012
0.51 0.33 10.50 10.50 7.60
0.012 0.008 0.396 0.398 0.291 0.050 BSC
0.020 0.013 0.413 0.413 0.299
0.75 1.27 8o
0.010 0.016 0o
0.030 0.050 8o
Note : 1. Followed from JEDEC MS-013 AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
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APA4863
Package Information
TSSOP-20
D SEE VIEW A
E1 e b
E
c 0.25 GAUGE PLANE A1 VIEW A TSSOP-20 L
0
A2
A
SEATING PLANE
S Y M B O L A A1 A2 b c D E E1 e L
MILLIMETERS MIN. MAX. 1.20 0.05 0.80 0.19 0.09 6.40 6.20 4.30 0.65 BSC 0.45 0o 0.75 8o 0.018 0o 0.15 1.05 0.30 0.20 6.60 6.60 4.50 0.002 0.031 0.007 0.004 0.252 0.244 0.169 MIN.
INCHES MAX. 0.047 0.006 0.041 0.012 0.008 0.260 0.260 0.177 0.026 BSC 0.030 8o
Note : 1. Follow JEDEC MO-153 AC. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
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APA4863
Package Information
TSSOP-20P
D SEE VIEW A
D1
EXPOSE D PAD
E2
E1 b A2
e
E
c 0.25 GAUGE PLANE SEATING PLANE VIEW A
0
A1
A
L
S Y M B O L A A1 A2 b c D D1 E E1 E2 e L 0
TSSOP-20P MILLIMETERS MIN. MAX. 1.20 0.05 0.80 0.19 0.09 6.40 3.00 6.20 4.30 2.50 0.65 BSC 0.45 0o 0.75 8o 0.018 0o 0.15 1.05 0.30 0.20 6.60 4.50 6.40 4.50 3.50 0.002 0.031 0.007 0.004 0.252 0.118 0.244 0.169 0.098 0.026 BSC 0.030 8o MIN. INCHES MAX. 0.047 0.006 0.041 0.012 0.008 0.260 0.177 0.260 0.177 0.138
Note : 1. Follow JEDEC MO-153 ACT. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
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APA4863
Carrier Tape & Reel Dimensions
OD0 P0 P2 P1 A E1 F K0 B SECTION A-A T B0 A0 OD1 B A SECTION B-B
d
Application
A 330.0O .00 2
H 50 MIN. P1 8.0O .10 0 H 50 MIN. P1 8.00O .10 0 H 50 MIN. P1 8.00O .10 0
H A
T1
T1 16.4+2.00 -0.00 P2 2.0O .10 0 T1 16.4+2.00 -0.00 P2 2.00O .10 0 T1 16.4+2.00 -0.00 P2 2.00O .10 0
C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00 C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00 C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00
d 1.5 MIN. D1 1.5 MIN. d 1.5 MIN. D1 1.5 MIN. d 1.5 MIN. D1 1.5 MIN.
D 20.2 MIN. T 0.6+0.00 -0.40 D 20.2 MIN. T 0.30O .05 0 D 20.2 MIN. T 0.30O .05 0
W 16.0O .30 0 A0
W
E1 1.75O .10 0 B0
F 7.5O .10 0 K0
SOP-16
P0 4.0O .10 0
6.40O .20 10.30O .20 2.10O .20 0 0 0 W 16.0O .30 0 A0 6.9O .20 0 W 16.0O .30 0 A0 6.9O .20 0 E1 1.75O .10 0 B0 6.90O .20 0 E1 1.75O .10 0 B0 6.90O .20 0 F 7.50O .10 0 K0 1.60O .20 0 F 7.50O .10 0 K0 1.60O .20 0 (mm)
Application
A 330.0O .00 2
TSSOP-20
P0 4.00O .10 0
Application
A 330.0O .00 2
TSSOP-20P
P0 4.00O .10 0
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APA4863
Devices Per Unit
Package Type SOP- 16 TSSOP- 20 TSSOP- 20P Unit Tape & Reel Tape & Reel Tape & Reel Quantity 1000 2000 2000
Taping Direction Information
SOP-16
USER DIRECTION OF FEED
TSSOP-20(P)
USER DIRECTION OF FEED
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APA4863
Classification Profile
Classification Reflow Profiles
Profile Feature Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time (tP)** within 5C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to peak temperature Sn-Pb Eutectic Assembly 100 C 150 C 60-120 seconds 3 C/second max. 183 C 60-150 seconds See Classification Temp in table 1 20** seconds 6 C/second max. 6 minutes max. Pb-Free Assembly 150 C 200 C 60-120 seconds 3C/second max. 217 C 60-150 seconds See Classification Temp in table 2 30** seconds 6 C/second max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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APA4863
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process - Classification Temperatures (Tc) Package Thickness <2.5 mm 2.5 mm
3
Volume mm <350 235 C 220 C
3
Volume mm 350 220 C 220 C
3
3
Table 2. Pb-free Process - Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm - 2.5 mm 2.5 mm Volume mm <350 260 C 260 C 250 C Volume mm 350-2000 260 C 250 C 245 C Volume mm >2000 260 C 245 C 245 C
3
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245C 1000 Hrs, Bias @ 125C 168 Hrs, 100%RH, 2atm, 121C 500 Cycles, -65C~150C VHBMU2KV VMMU200V 10ms, 1trU 100mA
Customer Service
Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838
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Price & Availability of APA4863KI-TRG

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